China Begins Production of Sub-3nm Chips Using Older DUV Technology

Following US sanctions and the blockade on ASML’s EUV machine sales, China has initiated efforts to manufacture chips smaller than 3 nanometers using older EUV technology. The Chinese Academy of Sciences (CAS) has provided preliminary guidance on developing gate-all-around (GAA) devices using deep ultraviolet (DUV) technology and has completed initial integration of stacked nanosheet-channel GAA sCMOS transistors. Experts at the Institute of Microelectronics, including Ye Tianchun, have described this as a new early-stage MOS transistor process route for China’s sub-3nm advanced production.

Due to the US-imposed restrictions limiting access to state-of-the-art EUV equipment, China has intensified its focus on manufacturing sub-3nm chips using legacy DUV technology. Chinese researchers have managed this achievement despite the absence of advanced lithography tools. Under US export control regulations, the Dutch company ASML is prohibited from selling its advanced EUV machines required for sub-7nm chip production to China.

Taiwanese media outlet Digitimes reported that CAS, with state backing, has provided foundational guidance on developing GAA devices utilizing DUV technology. Citing Ye Tianchun from the Institute of Microelectronics (IMECAS), the report highlights the successful early integration of stacked nanosheet-channel GAA sCMOS transistors using DUV equipment.

China is closely following global semiconductor industry leadership technologies. Transitioning from FinFET to GAA transistor structures is considered a significant leap in semiconductor manufacturing. Samsung Electronics has already commenced commercial production of 3nm chips using GAA technology, and Taiwanese company TSMC plans to adopt GAA technology for its 2nm node by the end of 2025.

However, the achievement by CAS has yet to scale to mass commercial production levels. Ye Tianchun, a former head of IMECAS, is regarded as a leading scientist in China’s government initiatives to enhance chip manufacturing equipment and capabilities, notably under the major project “02.” CAS has not issued any statements on this development to date. Earlier this year, Huawei Technologies made the most significant contribution to China’s chip self-reliance efforts by unveiling the timekeeping-based “Tau Scaling L” technology in May.